EN FR
Products
Capacitors
Capacitors
Aluminum Electrolytic Capacitors Ceramic Capacitors Film & Mica Capacitors Tantalum Capacitors
See All
Custom
Designs
Magnetics
Magnetics
Transformers Inductors Magnetic Winding
See All
Custom
Designs
Ohmcraft Resistors
Ohmcraft Resistors
Surface Mount Resistors Leaded resistors Custom resistors
See All
Custom
Designs
Position Sensors
Position Sensors
Precision Potentiometers Optical Rotary Encoders
See All
Custom
Designs
Slip Rings & Rotary Joints
Slip Rings & Rotary Joints
Slip Rings Integrated Solutions
See All
Custom
Designs
Filters
Filters
EMI-RFI filters EMC - TEMPEST - HEMP
See All
Custom
Designs
Materials & Tuning Components
Materials & Tuning Components
Ferrite Materials Dielectric Resonators Microwave Tuning Elements Coaxial Resonators
See All
Custom
Designs
Micropen
Micropen
Applications
Aviation
Defense
Space
Medical
Rail
Industry
Energy
Aviation
Commercial Aircraft
eVTOL
Defense
Military Aircraft
Land equipment
Naval
Space
Satellites & Constellations
Launchers
Exploration
Medical
Medical Imaging
Medical disposables
Implantable device
External defibrillator
Rail
Rolling stock
Signalling
Industry
Test & Measurement
Industrial Electronics
Telecom Antennas
Industrial robots
Energy
Renewable energy
Oil & Gas
About
Group
Quality & Environment

Working at Exxelia
Events
News

TCE, TCX, TCN, TXR Molded Series

Capacitors
|
Ceramic Capacitors
|
Standard
  • High Rel capacitors
  • Radial leaded
  • High thermal and voltage stability
  • Capacitance
1pF ~ 4.7µF
  • Tolerance
±1%, ±2%, ±5%, ±10%, ±20%
  • Mounting
Radial
  • Operating Temp
-55°C ~ 125°C
  • RoHS
ROHS, Non ROHS
  • Voltage Rated DC
25V ~ 500V
  • Case size
-
Download Datasheet (07-2024)
Send A Request

Typical applications :

  • Decoupling
  • Filtering

 

The below Part Numbers reflect our high runners only. 
Please contact us if you can't find your specifications.

PN
Capacitance
Voltage Rated AC
Tolerance
Mounting
Operating Temp
RoHS
Voltage Rated DC
Case size
TCE11L - - - - - 10pF +/-5% 63 V - - 10pF - ±5% Radial - Non ROHS 63V -
TCE11L - - - - - 22pF +/-5% 63 V - - 22pF - ±5% Radial - Non ROHS 63V -
TCE11N - - - - - 220pF +/-5% 63 V - - 220pF - ±5% Radial - Non ROHS 63V -
TCE11L - CG - - - 1nF +/-1% 63 V - - 1000pF - ±1% Radial - Non ROHS 63V -
TCE11L - CG - - - 1000pF +/-5% 63 V - - 1000pF - ±5% Radial - Non ROHS 63V -
TCE11L - CG - - - 1nF+/-10% 63 V - - 1000pF - ±10% Radial - Non ROHS 63V -
TCE11L - CG - - - 1500pF +/-5% 63 V - - 1500pF - ±5% Radial - Non ROHS 63V -
TCE11L - CG - - - 1650pF +/-1% 63 V - - 1650pF - ±1% Radial - Non ROHS 63V -
TCE11L - CG - - - 2200pF +/-5% 63 V - - 2200pF - ±5% Radial - Non ROHS 63V -
TCE11L - CG - - - 2.2nF +/-10% 63 V - - 2200pF - ±10% Radial - Non ROHS 63V -
TCE11L - CG - - - 2700pF +/-5% 63 V - - 2700pF - ±5% Radial - Non ROHS 63V -
TCE11L - UJ - - - 2700pF +/-5% 63 V - - 2700pF - ±5% Radial - Non ROHS 63V -
TCE11L - - W - - 3.32nF +/-1%63 V - - 3320pF - ±1% Radial - ROHS 63V -
Compliance and certifications
certification
CECC
Would you like to ajust a little something?

Customize it

Main applications

Frequently Asked Questions

Find answers to the most frequently asked questions about our products and services.
What is Ceramic Capacitors

Excellent temperature resistance, high volume/capacitance ratio, electrical properties and reliability make Exxelia's ceramic capacitors ideal for a wide range of fields of application including medical implants, aircraft flight controls, switched-mode power supply in harsh environments, core samplers for petroleum exploration, and space vehicles. Exxelia also offers Hyper Frequency ceramic capacitors with optimized size and very low ESR. 

These HiQ capacitors offer excellent performance levels for RF applications requiring functional reliability. Typically these applications include civil and military telecommunications (cellular base station equipment, wireless broadband service, Point to-Point or Multipoint radios, radio broadcasting equipment), and MRI coils.

How is Ceramic used in Capacitors ?

Ceramic chips are created with binders and solvents added to a specified ceramic powder. The slurry created is dried, forming a sheet or tape of ceramic material. Metal powder is mixed with solvents and additional ceramic material to create a liquid electrode. The liquid is then printed onto the ceramic layer. Layers of the ceramic sheets are stacked and laminated to form a solid structure.

The solid structure is cut into the desired size. Once cutting is complete, the assembly must be kiln fired. The temperature used in the firing process is critical in determining the capacitor’s characteristics. The process is similar for disc and chip styles. Disc capacitors use long leads to mount through circuit boards. Chips use surface mount technology.

Still have questions ?
Can’t find the answer you’re looking for ? Please contact with our customer service.
Contact